The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...

Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...

With its industry-standard tool for thermal and fluid analysis of space applications and satellites, C&R Technologies' thermal-centric modeling approach provides fast and effective system-level ...

ANSYS has launched a new open neutral file format to help electronic component manufacturers and their customers to easily share design models between different thermal simulation toolsets. The open ...

PITTSBURGH, USA: ANSYS has announced that its RedHawk and Totem products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET technology. TSMC has certified these ...

ANSYS, Inc. …today announced the latest release of ANSYS Icepak software, which provides robust and powerful fluid dynamics technology for electronics thermal management. The 12.0 release introduces ...

Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...

--Ansys today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18 A process technology. Intel Foundry and Ansys have also enabled a comprehensive ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...