SAN MATEO, Calif. — Stacked-die packaging — in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated — has taken root in the cell-phone handset market as ...

MUNICH, Germany — Samsung Electronics has expanded it's 'through silicon via' (TSV) technique to DRAM devices. The technique, introduced a year ago for NAND chips, allows the production of smaller and ...