The Mold-man 8000 can replace epoxy-potting operations for sealing and encapsulating electronic components. Operating at injection pressures as low as 15 psi or as high as 450 psi, the Mold-man can ...
Infused with nanosilica, this two-component epoxy system from Master Bond is suitable for potting, coating and sealing applications. EP114’s nanoparticles are designed for dimensional stability, ...
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