Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed wafer-level CoWoS ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, has licensed advanced packaging technology from Deca Technologies and has taken ...

The research team led by Distinguished Research Fellow Dr. Jun-Yeob Song at the Semiconductor Manufacturing Research Center, KIMM, is holding a large rectangular panel developed in collaboration with ...

With the industry recovery coming on slowly, cost is a more important factor than ever. Semiconductor manufacturers are constantly under pressure to reduce costs, and during a down cycle they must do ...

Get ready for wafer-level packaging. The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) said at Semicon West in San Francisco this week that it will install a complete 300mm line ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form ...