This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...
Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...
A potential breakthrough technology from Nextreme (Research Triangle Park, NC)—a microscale thermal and power-management device manufacturer—integrates cooling and power-generation capabilities into ...
At the recent IEEE Electronic Components and Technology Conference (ECTC), Imec presented a paper on a fine-pitch hybrid wafer-to-wafer bonding technology for heterogeneous integration. Imec described ...
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