MUNICH — Suss MicroTec Test Systems GmbH today announced a new device bonder tool featuring a powerful imaging system and bonding arm that enables high-accuracy assembly of optoelectronics modules.

GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched the SB6/8 Gen2 Wafer Bonder today. The ...

Karl Suss has introduced the CL200 Cleaner/SOI Bonder, designed for creating silicon-on-insulator (SOI) substrates and, according to the company, the first system that cleans, dries, aligns and bonds ...

GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS ...

EQS-News: SÜSS MicroTec SE / Key word(s): 9 Month figures/Quarterly / Interim Statement SUSS MicroTec receives record orders for bonders in the third quarter / Sales momentum slowed by delays in ...

SAINT-JEOIRE, France — Karl Suss France SA, a subsidiary of Munich-based Suss MicroTec AG, said it has completed expansion of a flip-chip bonder production facility here, doubling the plant's capacity ...

SAINT-JEOIRE, France--(BUSINESS WIRE)--Feb. 23, 2004--SUSS MicroTec S.A., French subsidiary of SUSS MicroTec AG (FWB:SMH), today announced it signed a Joint Development Program with IMEC, a world ...

The issuer is solely responsible for the content of this announcement. Highest precision: post-bond accuracy of ±200 nm Up to 40 percent space saving compared to other fully integrated D2W hybrid ...

GARCHING, DE / ACCESSWIRE / March 13, 2017 / SUSS MicroTec (SMHN.DE), a leading supplier of equipment and process solutions for the semiconductor industry and related markets, launched a brand-new ...

SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for ...

GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume ...

The Partnership of SUSS MicroTec and VTT Microelectronics Bears Fruit: the First Ever Nanoimprint Lithography System Able to Combine Both Hot and Cold Embossing on Wafer in a Step and Repeat Mode SUSS ...