ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...
JBD has announced that it has completed a major upgrade of its MicroLED microdisplay mass-production architecture, shifting from a 4-inch-based manufacturing architecture to a 12-inch reconstructed ...
Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory production. This strategic ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...
Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Chiplet-based architectures are gaining popularity for ...
The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet ...
Plymouth, UK -- Plessey, an embedded technologies developer at the forefront of microLED technology for the augmented reality (AR) and display markets, announces a partnership with Axus Technology ...
Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...
CNW/ - Xanadu Quantum Technologies Ltd. ("Xanadu") (NASDAQ: XNDU) (TSX: XNDU), a leading photonic quantum computing company, and EV Group (EVG), a ...
Embedded technologies developer and microLED specialist Plessey has announced a significant milestone in the development of its monolithic microLED displays alongside its backplane partner, Jasper ...
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