TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...
Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...
Jang Deok-hyun, president of Samsung Electro-Mechanics (photo), expressed his intention to expand the business into the glass interposer sector, following the glass substrate business, which is ...
The global Glass Interposers Market is witnessing accelerated demand driven by the rapid evolution of advanced semiconductor packaging, rising adoption of heterogeneous integration, and increasing ...
Advanced packaging has created new process bottlenecks related to the internal mechanics of the packaging equipment. As ...
Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently used in ...
It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...
TOKYO--(BUSINESS WIRE)--USHIO INC., (TOKYO:6925) (President and CEO: Shiro Sugata) today announced that the company installed one unit of a projection aligner dedicated to developing 2.5D glass ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results