Abstract: Surface mount technology (SMT) is a procedure for mounting electronic components to the surface of printed circuit boards (PCBs). Although the SMT procedure is more reliable than the ...
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction
Abstract: Solder reliability is a key aspect for the packaging of low voltage power semiconductor device. The interconnections among package components, e.g. the silicon chip and copper leadframe, and ...
The most-traded SHFE tin contract was in the doldrums near 390,000, as the market rationally released some transactions. [SMM Tin Midday Review] SHFE tin opened slightly lower in the night session and ...
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