Design And Reuse

Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices

Innatera adopts Synopsys simulation technology to help design neuromorphic chips that enable low-power AI for wearables, smart home devices, and digital twin industrial sensors. K ...
Design And Reuse

Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals

Built on Ceva’s third-generation PentaG platform, PentaG-NTN accelerates the convergence of satellite and cellular networks BARCELONA, Spain – MWC26 – As satellite connectivity rapidly becomes the ...
Design And Reuse

DCD-SEMI to Showcase CAN XL with Functional Safety and RISC-V Subsystems at Embedded World 2026 – Booth 4-481

With less than a week remaining before Embedded World 2026 opens in Nuremberg, DCD-SEMI announces it will present its latest silicon-proven IP Core solutions at Booth 4-481, with a focus on CAN XL ...
Design And Reuse

Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets

Faraday continues building out its IP solutions on UMC’s 14nm node. All these IPs are silicon-proven to ensure production-quality, significantly reducing design risk while assisting designers in ...
Design And Reuse

Samsung Electronics Announces Strategy To Transition Global Manufacturing Into ‘AI-Driven Factories’ by 2030

Company is set to expand Agentic AI across manufacturing and will unveil its industrial AI vision at MWC 2026 ...
Design And Reuse

Rapidus Secures 267.6 Billion Yen in Funding from Japan Government and Private Sector Companies

TOKYO – Rapidus Corporation today announced that it has completed a funding round totaling 267.6 billion yen (equivalent to $1.7 billion USD) from the Japan government and private sector companies.
Design And Reuse

ASML announces breakthrough in EUV light source to boost chip output

ASML has unveiled a significant advance in the power of the light source used in its extreme ultraviolet (EUV) lithography systems, a development the company says could enable chipmakers to produce up ...
Design And Reuse

MWC: Ericsson and Intel join for 6G AI-RAN

Ericsson and Intel are collaborating for the transition to AI-native 6G deployments and use cases. The collaboration will span mobile connectivity, cloud technologies, and compute capabilities across ...
Design And Reuse

Synopsys Posts Financial Results for First Quarter Fiscal Year 2026

SUNNYVALE, Calif. -- Synopsys, Inc. (Nasdaq: SNPS) today reported results for its first quarter of fiscal year 2026. Revenue for the first quarter of fiscal year 2026 was $2.409 billion, compared to ...
Design And Reuse

Weebit Nano achieves record half-year revenue; licenses ReRAM to Tier-1 Texas Instruments

Weebit Nano Ltd (ASX: WBT, Weebit or Company) provides its interim results and Appendix 4D for the six months ended 31 December 2025 ( H1 FY26 ). Record half-year revenue of A$5.6 million – more than ...
Design And Reuse

BrainChip Named Official Technology Sponsor for Raytheon’s "Operation Touchdown" Autonomous Vehicle Competition

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, today announced its role as the ...
Design And Reuse

Renesas Looks to the Future of Automotive With New Memory and SoC Tech

Renesas’s first announcement at ISSCC revealed three SoC technologies intended for high-performance automotive multi-domain ECUs. These chips must simultaneously execute heterogeneous workloads while ...