Skyworks and Mediatek have produced a reference design of a 6G FR3 frequency range RF front-end (RFFE) power amplifier. The ...

Toraypearl PA12 is expected to contribute to higherquality 3D-printed parts in applications requiring durability, airtightness, and mechanical reliability, thereby expanding its potential use in both ...

ASML is looking at expanding from front-end litho into packaging, according to CTO Marco Pieters (pictured).

Imec’s NanoIC pilot line has brought out two PDKs for sub-2nm processes: a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK. These early-access PDKs bring advanced ...

For the small-signal frequency performance the researchers report for a 100nm-gate HEMT cut-off (f T )/maximum oscillation (f max) respective values of 100GHz/254GHz at 10V drain. The f max value for ...

The ‘Transdeptor’ – a remote reading fluid depth gauge developed bySolartron’s Transducer Division – provides a reliable method of transmitting depth measurements over considerable distances. So, 65 ...

“Each output channel of the S8AS2 is equipped with independent electronic circuit protection. In the event of an overload or short circuit, only the affected channel is shut down, allowing other ...

Last week Kevin O’Buckley senior vice-president and general manager of Intel Foundry Services, resigned to go to Qualconm. The writing appears to be on the wall for Intel’s attempt to catch up in ...

Jedec has officially updated the Universal Flash Storage (UFS) with UFS 5.0. It aims to increase storage performance and efficiency for edge device AI applications.