BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...

SHENMAO America, Inc. is proud to announce the launch of its advanced solder paste, PF606-P275. This innovative lead-free, no-clean, zero- halogen solder paste is specifically designed for fine-pitch ...