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A new PCB design can boost heat dissipation by 55x – copper coins placed under heat generating components drop temps drastically
OKI Circuit Technology has announced a new printed circuit board (PCB) design that can boost component heat dissipation by up to 55x. The Japanese firm has been developing and manufacturing PCBs ...
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Industrial alliance coins circular model for composites in nautical construction
This breakthrough initiative unites various global leaders in their field: Groupe Beneteau, world’s leading manufacturer of ...