Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction
Abstract: Solder reliability is a key aspect for the packaging of low voltage power semiconductor device. The interconnections among package components, e.g. the silicon chip and copper leadframe, and ...
Abstract: Surface mount technology (SMT) is a procedure for mounting electronic components to the surface of printed circuit boards (PCBs). Although the SMT procedure is more reliable than the ...
A look at Royal Selangor’s Autumn/Winter 2025 collection as the brand celebrates 140 years of tin heritage and artisanal ...
Similar to silver (but less expensive and more malleable), pewter is a mixture of various metals (mostly tin) that’s been used for centuries in items like silverware, jewelry, and decorative items, ...
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