IEEE.tv

APEC 2026 Plenary Sessions

PMAPEC 2026 Welcome And Conference OpeningIntroduction: Stephanie Watts Butler, APEC 2026 Plenary ChairOpening Welcome Message: Jin Wang, APEC 2026 General ChairPlenary Introduction: by Dhaval Dalal, ...
IEEE.tv

Indrajit Zope

Indrajit is highly experienced SAP Senior Solution Architect having expertise in designing and implementing SAP solutions across multiple industries.
IEEE

The Impact of Hybrid Bonding on Testing 3D-Stacked Dies

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Reliability and Yield for Die-to-Wafer Hybrid Bonded 8-High Stacks with TSV

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Hybrid Bonding Symposium: Panel - Enabling Hybrid Bonding Proliferation

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Wafer-to-wafer Bonding Overlay: Co-Optimization with Lithography and Hidden Patterns

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Sub 100nm Die-to-Wafer Hybrid Bonding Drives Foundry 2.0

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Reducing Wafer-to-Wafer Bonding Misalignment to Enable sub 150nm Pitch Hybrid Bonding

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

From Elastic Expansion to Cu Bulge-Out: Mechanisms, Measurements, and Modeling for Sub-Micron Hybrid Bonding

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Effect of Cu Microstructures on the Thermal Expansion of SiO2 Structures for 3D IC Heterogeneous Integration

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Technology of Cleaning and Activation Using Surface Wave Excited Plasma Downstream for Hybrid Bonding

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE

Challenges and Impact of Surface Properties on Wafer-level Hybrid Bonding Process for Industrial Application

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...