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오늘은 LB세미콘의 대표적인 사업인 Bumping 공정 동영상을 보겠습니다:) Bumping은 반도체 칩과 기판을 연결해주는 단자 역할을 하며, 보통 금이나 솔더를 이용해 bump를 형성합니다. 이를 위해 다음과 같은 공정이 시행됩니다. Bumping is a technology in flip chip applications providing interconnects between chip and package substrate. Bumps are usually made of gold and solder. Following process is conducted to form bumps on the wafers. 금속층 형성(UBM Sputtering) → PR코팅(PR Coating) → 포토 공정(Photolithography) → 현상(Developing) → 금 플레이팅(Au Plating) → PR층 깎기(PR Stripping) → 금속층 식각(UBM Etching) | L
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